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Comparative Studies | Electronics & Communication Engineering | India | Volume 2 Issue 4, April 2013 | Popularity: 6.8 / 10
Comparative Study of Radiated Emission in Various Microstripline Structures on Printed Circuit Boards
P.Rajeswari, Krithika Venkatesh, S.Shunmuga Lakshmi
Abstract: The enormous advancement in science and technology has led to increase in the requirements for high speed data transmission. The increase in the speed of the digital circuits as well as the density of printed circuit board will often result in more challenging signal integrity issues. One of the most important signal integrity issues is radiated emission. We analyzed the radiation in different PCB structures like parallel microstripline, a 90° bend microstripline and serpentine microstripline. The radiation mechanism from various PCB structures is predicted and simulated by using Ansoft HFSS. Simulated results are compared with the existing structures.
Keywords: Signal Integrity, Radiated Emission, PCB, Microstriplines
Edition: Volume 2 Issue 4, April 2013
Pages: 188 - 192
Make Sure to Disable the Pop-Up Blocker of Web Browser
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Electronics & Communication Engineering, India, Volume 3 Issue 7, July 2014
Pages: 1810 - 1814Implementation of Door Control System Using Ladder Language
Ritu Phogat, Lokeshwar
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Electronics & Communication Engineering, India, Volume 9 Issue 1, January 2020
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Electronics & Communication Engineering, Sudan, Volume 4 Issue 12, December 2015
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Electronics & Communication Engineering, India, Volume 3 Issue 1, January 2014
Pages: 225 - 228Nanotechnology: Green Innovation
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Electronics & Communication Engineering, India, Volume 3 Issue 12, December 2014
Pages: 162 - 164LiDAR Mapping: A Remote Sensing Technology
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